![]() ![]() So using a Lead containing solder removed the Tin whiskers risk as well as solder breakdown (cold solder joints) which is also present. The 2011 GPU’s had this failure internally as the chip ran hotter and Apple failed to cool the GPU effectively. It is believed excessive heat aggravates this process. This can happen within either solder join area. As the volume of Tin increases in the solder, the Tin can create whiskers! This is when the tin migrates material to an apposing charge ( NASA - What are Tin Whiskers). The issue is in fact the soldering which can be either the chips external connections or it can be the joints within the chip (FlipChip).Īpple’s push for lead-free solder while noble got them into trouble. Arberman is correct the 2011 models have a bad GPU and/or the VRAM chips.
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